THE EFFECT OF KCl PLATING BATH TEMPERATURE ON THE REFLECTANCE OF Cu/Ag

Toifur, Moh. (2007) THE EFFECT OF KCl PLATING BATH TEMPERATURE ON THE REFLECTANCE OF Cu/Ag. [Artikel Dosen]

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Abstract

THE EFFECT OF KCl PLATING BATH TEMPERATURE ON THE REFLECTANCE OF Cu/Ag.
Deposition of Ag on the Cu substrate has been done at the various plating bath temperature to obtain the optimum
temperature of plating bath that can produce the highest reflectance coefficient. KCl which is used as plating bath
was set at various temperatures from 60 up to 90 °C. Electrolysis process was supplied with 5 volt DC voltage
during 7 minutes deposition. Many characterizations were done including the ordering of crystalline structure,
sheet resistivity and reflectance, each of these was done by XRD, four point probe and UV-vis spectrometer from
390 up to 790Å wave length. The result shows that the optimum plating bath temperature for producing the highest quality Ag film was 80°C which has the highest ordering crystalline structure, sheet resistivity of 0.52 ohm/sq and reflectance coefficient of 98%.
Key words : Plating bath temperature, reflectance

Item Type:	Artikel Dosen
Subjects:	Q Science > QC Physics
Divisi / Prodi:	Faculty of Teacher Training and Education (Fakultas Keguruan dan Ilmu Pendidikan) > S2-Masters in Physics Education (S2-Pendidikan Fisika)
Depositing User:	Dr., M.Si. Moh Toifur
Date Deposited:	02 May 2020 20:31
Last Modified:	02 May 2020 20:31
URI:	http://eprints.uad.ac.id/id/eprint/18591

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