EC00202039477, 13 Oktober 2020 (2020) Sintesis Lapisan Tipis Cu/Ni Dengan Metode Elektroplating Berbantuan Medan Magnet Luar Sejajar Arus Ion. 000207976.
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HKI_.pdf Download (775kB) |
Item Type: | Patent |
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Subjects: | Q Science > QC Physics |
Depositing User: | Dr. Widodo Raharjo |
Date Deposited: | 26 Aug 2021 14:17 |
Last Modified: | 26 Aug 2021 14:17 |
URI: | http://eprints.uad.ac.id/id/eprint/27492 |
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