Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).
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15. JURNAL_Structure And Resistivity Of CuNi Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation.pdf Download (1MB) |
| Item Type: | Artikel Umum |
|---|---|
| Subjects: | Q Science > QC Physics |
| Divisi / Prodi: | Faculty of Teacher Training and Education (Fakultas Keguruan dan Ilmu Pendidikan) > S1-Physics Education (S1-Pendidikan Fisika) |
| Depositing User: | M.Pd.Si. Oki Mustafa |
| Date Deposited: | 15 Feb 2022 04:57 |
| Last Modified: | 15 Feb 2022 04:57 |
| URI: | http://eprints.uad.ac.id/id/eprint/29431 |
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