Structure And Resistivity Of CuNi Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Structure And Resistivity Of CuNi Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).

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Item Type: Artikel Umum
Subjects: Q Science > QC Physics
Divisi / Prodi: Faculty of Teacher Training and Education (Fakultas Keguruan dan Ilmu Pendidikan) > S1-Physics Education (S1-Pendidikan Fisika)
Depositing User: M.Pd.Si. Oki Mustafa
Date Deposited: 15 Feb 2022 05:17
Last Modified: 15 Feb 2022 05:17
URI: http://eprints.uad.ac.id/id/eprint/29663

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