Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi (2020) PEER REVIEW_Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. IAEME Publication.
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Abstract
Cu/Ni thin film has been made with an electroplating method assisted with a
parallel magnetic field on deposition time variation. The purpose of this research is to
find out the thickness, microstructure, and resistivity of Cu/Ni thin film. The
electroplating process was carried out with a magnetic field of 150 G, a solution
temperature of 60°C, and an electrode distance of 4 cm. The solution used was made
from the mixture of H3BO3 40 gram, NiSO4 260 gram, NiCl2 60 gram, and H2O 1000
ml. The deposition time was varied from 60 s to 540 s. Deposition time has a positive
influence on the thickness of the film, which is the longer deposition time the thicker
Ni film. Deposition time also influences the microstructure parameter of Ni film. The
Ni [111] dif raction peak is at an angle of approximately 44.8°. The intensity of the
dif raction peak has an upward trend from the time of 60 s to 320 s and then it has a
downward trend. Meanwhile, the profile of the grain size curve is similar to the
distance of crystal plane which is from 60 s to 120s it goes down, then from 120 s to
420 s it goes up and then goes down again. However, the sheet resistivity has an
upward trend towards deposition time.
| Item Type: | Other |
|---|---|
| Keyword: | Cu/Ni thin film, electroplating, deposition time, parallel magnetic field |
| Subjects: | Q Science > QC Physics |
| Depositing User: | M.Pd.Si. Oki Mustafa |
| Date Deposited: | 10 Dec 2022 03:34 |
| Last Modified: | 10 Dec 2022 03:45 |
| URI: | http://eprints.uad.ac.id/id/eprint/37888 |
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