Electroplated Cu/Ni Coil Sensors for Cryogenic Applications: Low-Cost Temperature Monitoring in Industrial and Scientific Settings

Toifur, Moh. and Okimustava, Okimustava Electroplated Cu/Ni Coil Sensors for Cryogenic Applications: Low-Cost Temperature Monitoring in Industrial and Scientific Settings. [Artikel Dosen] (In Press)

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Abstract

Cryogenic temperature sensors are crucial in various scientific and industrial applications requiring precise
low-temperature measurements, including in medicine, food technology, aerospace, and quantum research. This study
presents the development of a low-cost temperature sensor using copper-nickel (Cu/Ni) wire fabricated through
electroplating at different electrode voltages: 0 V, 4.5 V, 6.0 V, and 7.5 V. The electroplating process employed a NiSO₄
NiCl₂–H₃BO₃ electrolyte solution at 60 °C. The sensors were tested in liquid nitrogen to evaluate their performance in the
cryogenic range, focusing on response time, voltage range, sensitivity, and hysteresis loss. All sensors demonstrated
responsiveness within −160 °C to 0 °C. While the pure copper sensor showed the fastest response and widest voltage
range (180 s and 0.02 V), it lacked thermal stability. The sensor plated at 4.5 V had a slower response (300 s) and
moderate sensitivity, whereas increasing the deposition voltage to 6.0 V enhanced sensitivity and reduced hysteresis loss
(0.0023 V), indicating improved stability. Comparisons with Ag, Cu, and Pt-100 sensors confirmed that Cu/Ni sensors,
especially those deposited at 4.5 V and 6.0 V, provided significantly smaller resistance changes, highlighting their
potential for stable and economical cryogenic temperature monitoring.

Item Type: Artikel Dosen
Subjects: Q Science > QC Physics
Divisi / Prodi: Faculty of Teacher Training and Education (Fakultas Keguruan dan Ilmu Pendidikan) > S2-Masters in Physics Education (S2-Pendidikan Fisika)
Depositing User: Dr., M.Si. Moh Toifur
Date Deposited: 24 Jun 2025 01:54
Last Modified: 24 Jun 2025 01:54
URI: http://eprints.uad.ac.id/id/eprint/84479

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