Items where Author is "Khusnani, Azmi"

Toifur, Moh. and Khusnani, Azmi and Okimustava, Okimustava (2020) C3. S2 Pendidikan Fisika, Yogyakarta. (Unpublished)

Toifur, Moh. and Khusnani, Azmi and Okimustava, Okimustava (2020) H-Index Universal Journal of Electrical and Electronic Engineering. Program Magister Pendidikan Fisika Program Pascasarjana Universitas Ahmad Dahlan, Yogyakarta. (Unpublished)

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi (2020) PEER REVIEW_Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. IAEME Publication.

Taufiqurrahman, M and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi (2020) Peer REVIEW_Effect Of Solution Temperature On Voltage Range And Sensitivity Of Lowtemperature Sensor Cu/Ni Results From Electroplating Assisted By Parallel Magnetic Fields. IAEME Publication.

setiamukti, danurdara and Toifur, Moh. and Ishafit, Ishafit and Khusnani, Azmi and Okimustava, Okimustava Effects Of Electrolyte Concentration On The Voltage Range And Response Time Of Cu/Ni Film For Low Temperature Sensor. International Journal of Advanced Research in Engineering and Technology (IJARET).

setiamukti, danurdara and Toifur, Moh. and Ishafit, Ishafit and Khusnani, Azmi and Okimustava, Okimustava Effects Of Electrolyte Concentration On The Voltage Range And Response Time Of Cu/Ni Film For Low Temperature Sensor. International Journal of Advanced Research in Engineering and Technology (IJARET).

ansarudin, muhammad and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Microstructure And Resistivity Of The Electroplated Ni Aided By The Magnetic Field Parallel To The Electric Field On The Deposition Voltage Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).

Ansarudin, muhammad and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Microstructure And Resistivity Of The Electroplated Ni Aided By The Magnetic Field Parallel To The Electric Field On The Deposition Voltage Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Structure And Resistivity Of CuNi Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).