Items where Author is "Saputra, Julius"

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi (2020) PEER REVIEW_Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. IAEME Publication.

Raga, Revamia Putri Anugrah and Nugroho, Wishnu and Surikno, Okik and Karsih, Karsih and Nurjannah, Layly Siti and Saputra, Julius and Ranjani, Nuha Farihah and Putri, Nurma Hudya and Siwi, Getria Raka LAPORAN KKN REGULER UNIVERSITAS AHMAD DAHLAN PERIODE LXI TAHUN AJARAN 2016/2017 DESA DUREN KECAMATAN TENGARAN KABUPATEN SEMARANG PROVINSI JAWA TENGAH. LAPORAN KKN REGULER UNIVERSITAS AHMAD DAHLAN PERIODE LXI TAHUN AJARAN 2016/2017 DESA DUREN KECAMATAN TENGARAN KABUPATEN SEMARANG PROVINSI JAWA TENGAH.

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Structure And Resistivity Of Cu/Ni Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).

Saputra, Julius and Toifur, Moh. and Okimustava, Okimustava and Khusnani, Azmi Structure And Resistivity Of CuNi Thin Film –Effects Of Electroplating Assisted With Parallel Magnetic Field On Deposition Time Variation. International Journal of Advanced Research in Engineering and Technology (IJARET).